Long-range connectivity with
excellent battery performance.


Ultra-compact solution
LoRaWan & Bluetooth.


Low-Power NB2-IoT solution
for global IoT applications.


It is the latest SiP in HT Micron’s family of products aimed at massive IoT (Internet of Things) applications. Equipped with a Qualcomm QCX212® transceiver, 4MB of NOR Flash, Arm Cortex M3 MCU and embedded eSIM option, this product offers the market the possibility of developing massive IoT applications at low cost, taking advantage of the wide coverage of cellular networks.


The iMCP HTLRBL32L is the second SiP to join HT Micron’s family of products aimed at massive IoT applications. In addition to connectivity with the LoRa network, one of the main long-distance, low-power networks (LPWAN), it also features Bluetooth 5.2 connectivity, which allows application developers to further increase the possibilities for developing IoT devices.

Equipped with an Arm Cortex M0+ MCU and 256KB of internal memory, this SiP also has the option of an on-board security element, as well as being prepared for automatic connectivity to LoRa networks anywhere in the world.

iMCP HTLRBL32L RoHS Test Report

Sigfox iMCP HT32SX

The iMCP – HT32SX is a Multicomponent Integrated Circuit (MCO) designed to provide a ready-to-use connectivity solution for IoT (Internet of Things) applications.

It is the first product in HT Micron’s new family of SiPs (System-in-Package) aimed at the mass IoT market. This component has 64KB of internal memory, an Arm Cortex M0+ MCU, small dimensions, very low power consumption and automatic compatibility with Sigfox® networks worldwide, which reduces development time and delivers the best experience for IoT application developers.

iMCP HT32SX RoHS Test Report


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